Patents/Inventors

Mitul Modi

Phoenix, AZUS19 patents

18 Patents

US125754152026
Keep Out Zone with Hydrophobic Surface for Integrated Circuit (IC) Package
SK Hynix NAND Product Solutions Corp.
0 cites
US124761742025
Ultra-thin, Hyper-density Semiconductor Packages
Intel Corporation
0 cites
US124226152025
Nested Glass Packaging Architecture for Hybrid Electrical and Optical Communication Devices
Intel Corporation
0 cites
US124069142025
Ultra-thin, Hyper-density Semiconductor Packages
Intel Corporation
0 cites
US123929702025
Photonic Integrated Circuit Packaging Architectures
Intel Corporation
0 cites
US122611502025
Mold Shelf Package Design and Process Flow for Advanced Package Architectures
Intel Corporation
0 cites
US121762682024
Open Cavity Bridge Co-planar Placement Architectures and Processes
Intel Corporation
0 cites
US120877312024
No Mold Shelf Package Design and Process Flow for Advanced Package Architectures
Intel Corporation
0 cites
US120682222024
Dummy Die Structures of a Packaged Integrated Circuit Device
Intel Corporation
0 cites
US120402462024
Chip-scale Package Architectures Containing a Die Back Side Metal and a Solder Thermal Interface Material
Intel Corporation
0 cites
US120274482024
Open Cavity Bridge Power Delivery Architectures and Processes
Intel Corporation
0 cites
US119423932024
Substrate with Thermal Insulation
Intel Corporation
0 cites
US119013332024
No Mold Shelf Package Design and Process Flow for Advanced Package Architectures
Intel Corporation
0 cites
US117354952023
Active Package Cooling Structures Using Molded Substrate Packaging Technology
Intel Corporation
0 cites
US117053772023
Stacked Die Cavity Package
Intel Corporation
0 cites
US116111642023
Wideband Multi-pin Edge Connector for Radio Frequency Front End Module
Intel Corporation
0 cites
US115748512023
Coupled Cooling Fins in Ultra-small Systems
Intel Corporation
0 cites
US115454072023
Thermal Management Solutions for Integrated Circuit Packages
Intel Corporation
0 cites