Patents/Inventors

Mitsuyasu Furusawa

TokyoJP1 patent

2 Patents

US121387142024
Flux, Solder Paste, Soldering Process, Method for Producing Soldered Product, and Method for Producing BGA Package
KOKI COMPANY LIMITED
0 cites
US118256122023
Flux, Solder Paste, and Method for Producing Electric Circuit Board
KOKI Company Limited
0 cites