3 Patents
- US124246022025Bonded Assembly Containing Conductive via Structures Extending Through Word Lines in a Staircase Region and Methods for Making the Same
Sandisk Technologies, Inc.
0 cites - US119357842024Three-dimensional Memory Device Containing Self-aligned Bit Line Contacts and Methods for Forming the Same
SANDISK TECHNOLOGIES LLC
0 cites - US118896842024Three-dimensional Memory Device with Separated Source-side Lines and Method of Making the Same
SANDISK TECHNOLOGIES LLC
0 cites