3 Patents
- US126108742026Connection Structural Body with Cu—cu Bonding and Roughened Surface Deposits
SHINSHU UNIVERSITY
0 cites - 0 cites
- US117068772023Composite Wiring Substrate and Semiconductor Device
SHINKO ELECTRIC INDUSTRIES CO., Ltd.
0 cites
SHINSHU UNIVERSITY
SHINKO ELECTRIC INDUSTRIES CO., Ltd.