9 Patents
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- US125989772026Fill of Vias in Single and Dual Damascene Structures Using Self-assembled Monolayer
Intel Corporation
0 cites - US125001622025Staggered Vertically Spaced Integrated Circuit Line Metallization with Differential Vias and Metal-selective Deposition
Intel Corporation
0 cites - US124827442025Subtractively Patterned Interconnect Structures for Integrated Circuits
Intel Corporation
0 cites - US120274582024Subtractively Patterned Interconnect Structures for Integrated Circuits
Intel Corporation
0 cites - 0 cites
- US118942702024Grating Replication Using Helmets and Topographically-selective Deposition
Intel Corporation
0 cites - 0 cites
- US116643052023Staggered Lines for Interconnect Performance Improvement and Processes for Forming Such
Intel Corporation
0 cites