Miriam R. Reshotko

6 Patents

• US126219792026

  Multi-tier Memory Structure with Graded Characteristics

  INTEL CORPORATION

  0 cites
• US125640352026

  Airgaps Used in Backend Memory Structures

  Intel Corporation

  0 cites
• US123961552025

  Backend Memory with Air Gaps in Upper Metal Layers

  Intel Corporation

  0 cites
• US121838312024

  Self-aligned Contacts for Thin Film Transistors

  Intel Corporation

  0 cites
• US117495602023

  Cladded Metal Interconnects

  Intel Corporation

  0 cites
• US116108102023

  Maskless Air Gap Enabled by a Single Damascene Process

  Intel Corporation

  0 cites