6 Patents
- US125923662026Substrate Processing Apparatus and Substrate Processing Method Using the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US123225772025Plasma Baffle, Substrate Processing Apparatus Including the Same, and Substrate Processing Method Using the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US122223622025Method of Measuring Parameters of Plasma, Apparatus for Measuring Parameters of Plasma, Plasma Processing System, and Method of Processing Wafer
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US122100452025Impedance Measurement Jig and Method of Controlling a Substrate-processing Apparatus Using the Jig
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US120209032024Plasma Etching Method and Semiconductor Device Fabrication Method Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US115453412023Plasma Etching Method and Semiconductor Device Fabrication Method Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites