Minseung Yoon

3 Patents

• US124314742025

  Semiconductor Package

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US121425732024

  Interposer and Semiconductor Package Including the Same

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US117841312023

  Interposer and Semiconductor Package Including the Same

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites