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Minseung Ji
Seoul
KR
2 patents
3 Patents
US12272652
2025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US11749592
2023
Package-on-package Type Semiconductor Package Including a Lower Semiconductor Package and an Upper Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US11676904
2023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites