11 Patents
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- US124244892025Semiconductor Device Including Multi-capping Layer and Method for Manufacturing the Same
Samsung Electronics Co., Ltd.
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- US120806632024Semiconductor Devices Including a Thick Metal Layer and a Bump
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US120723742024Detection Pad Structure for Analysis in a Semiconductor Device
Samsung Electronics Co., Ltd.
0 cites - US118174082023Semiconductor Devices Including a Thick Metal Layer and a Bump
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- US117568432023Semiconductor Devices Including Scribe Lane and Method of Manufacturing the Semiconductor Devices
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- US115575562023Semiconductor Devices Including a Thick Metal Layer and a Bump
SAMSUNG ELECTRONICS CO., Ltd.
0 cites