Patents/Inventors

Minjun Bae

Hwaseong-siKR6 patents

7 Patents

US122305562025
Semiconductor Package and Method of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites
US121600052024
Black Metallic Nanorod Arrays and Method of Manufacturing Thereof
Wayne State University
0 cites
US120149752024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119730282024
Redistribution Substrate, Method of Fabricating the Same, and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119488722024
Semiconductor Package and Method of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites
US118943382024
Wafer Level Package
Samsung Electronics Co., Ltd.
0 cites
US116005642023
Redistribution Substrate, Method of Fabricating the Same, and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites