9 Patents
- US125790632026Efficient Machine Learning Caching via Attention Output-based Token Eviction
QUALCOMM Incorporated
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- US124245852025Apparatus for Bonding Chip Band and Method for Bonding Chip Using the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US123734942025Speculative Decoding in Autoregressive Generative Artificial Intelligence Models
QUALCOMM Incorporated
0 cites - US122291922025Speculative Decoding in Autoregressive Generative Artificial Intelligence Models
QUALCOMM Incorporated
0 cites - 0 cites
- US121365632024Semiconductor Manufacturing Apparatus Including Bonding Head
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
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