Ming-yuan Gao

4 Patents

• US124697452025

  Conductive Structures with Bottom-less Barriers and Liners

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US121659752024

  Method of Forming Interconnect Structure Having a Barrier Layer

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US120947702024

  Ruthenium-based Liner for a Copper Interconnect

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US117422902023

  Interconnect Structure and Method of Forming Thereof

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites