2 Patents
- US123278062025Semiconductor Die with Peculiar Bond Pad Arrangement for Leveraging Mutual Inductance Between Bond Wires to Realize Bond Wire T-coil Circuit with Equivalent Negative Inductance
Airoha Technology (HK) Limited
0 cites - US122782062025Semiconductor Package with Conductive Adhesive That Overflows for Return Path Reduction and Associated Method
Airoha Technology (HK) Limited
0 cites