Ming-yi Shen

3 Patents

• US126108062026

  Interconnect Structures with Nitrogen-rich Dielectric Material Interfaces for Low Resistance Vias in Integrated Circuits

  Intel Corporation

  0 cites
• US122867062025

  Structures and Methods for Processing a Semiconductor Substrate

  Taiwan Semiconductor Manufacturing CO., Ltd.

  0 cites
• US122438482025

  Methods and Systems for Improving Fusion Bonding

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites