Patents/Inventors

Ming-yen Pan

Taipei CityTW11 patents

3 Patents

US126044152026
Circuit Board Structure and Method for Manufacturing the Same
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites
US125000922025
Chip Package Structure and Method for Fabricating the Same
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites
US124328522025
Circuit Board Structure with Embedded Ceramic Substrate and Manufacturing Process Thereof
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites