Patents/Inventors

Ming-tsu Chung

HsinchuTW7 patents

8 Patents

US124890162025
Integrated Circuit Packages and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123623152025
Heterogeneous Dielectric Bonding Scheme
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123226802025
Semiconductor Device Having Backside Interconnect Structure on Through Substrate Via
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120877322024
Isolation Bonding Film for Semiconductor Packages and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120740642024
TSV Structure and Method Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US118698692024
Heterogeneous Dielectric Bonding Scheme
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US118239792023
Method of Forming Semiconductor Device Having Backside Interconnect Structure on Through Substrate Via
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US117216662023
Isolation Bonding Film for Semiconductor Packages and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites