Ming-kai Liu

6 Patents

• US124009362025

  Stacked Memory Cube with Integrated Thermal Path for Enhanced Heat Dissipation

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US122058882025

  Semiconductor Packages and Methods of Forming the Same

  Taiwan Semiconductor Manufacturing Company, Ltd

  0 cites
• US121487352024

  Memory Device and Manufacturing Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US119293192024

  Integrated Fan-out Packages and Methods of Forming the Same

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US118943302024

  Methods of Manufacturing a Semiconductor Device Including a Joint Adjacent to a Post

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.

  0 cites
• US115519992023

  Memory Device and Manufacturing Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites