6 Patents
- US125754062026Passivation Structure with Increased Thickness for Metal Pads
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US120574182024Passivation Structure with Increased Thickness for Metal Pads
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US117422622023Integrated Circuit Having a Resistor Layer Partially Overlapping Endcaps
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US117424342023Memory Device Having Recessed Active Region
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US115748822023Pad Structure and Manufacturing Method Thereof in Semiconductor Device
Taiwan Semiconductor Manufacturing Company Ltd.
0 cites - US115455842023Memory Device Having Recessed Active Region
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites