12 Patents
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- US122781512025Semiconductor Wafer Seal Ring Having Protrusion Extending Into Trench in Semiconductor Substrate
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121837792024Integrated Circuit and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121763722024Dielectric Structure Overlying Image Sensor Element to Increase Quantum Efficiency
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120877562024Protective Wafer Grooving Structure for Wafer Thinning and Methods of Using the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US118323802023Fan Structure Automatically Mountable on a System Circuit Board
ASIA VITAL COMPONENTS CO., Ltd.
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- US116705392023Method of Making a Semiconductor Arrangement
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US116644112023Semiconductor Structure Having Integrated Inductor Therein
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - 0 cites
- US115520662023Protective Wafer Grooving Structure for Wafer Thinning and Methods of Using the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites