Patents/Inventors

Min-yao Chen

Nanjing CityCN9 patents

8 Patents

US125990032026
Manufacturing Method of Package Substrate
Aaltosemi Inc.
0 cites
US125576642026
Electronic Package and Fabricating Method Thereof
Aaltosemi Inc.
0 cites
US125507652026
Package Substrate and Fabricating Method Thereof
Aaltosemi Inc.
0 cites
US125507672026
Package Substrate and Fabricating Method Thereof
Aaltosemi Inc.
0 cites
US125507962026
Electronic Package and Fabricating Method Thereof
Aaltosemi Inc.
0 cites
US124944372025
Substrate Structure Including Different Size of Electronic Component
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US123158282025
Package Substrate, Electronic Device Package and Method for Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites
US119977982024
Package Substrate and Method for Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites