16 Patents
- US126160472026Method of Fabricating a Semiconductor Package Including an Interposer
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US126073902026Laminate for Bi-directional Color Radiative Cooling and Material for Radiative Cooling Including the Same
Kia Corporation
0 cites - US124181692025Direct Current/direct Current Converter and Control Method Thereof
LG INNOTEK CO., Ltd.
0 cites - 0 cites
- US122726552025Semiconductor Devices and Methods of Manufacturing Semiconductor Devices
Amkor Technology Singapore Holding Pte. Ltd.
0 cites - US122197742025Nonvolatile Memory Chip and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US121731332024Preparing Method for Conductive Composite, Conductive Composite and Piezoresistive Device Using the Same
KIA CORPORATION
0 cites - US120988922024Laminate for Radiational Cooling, and Method for Preparing the Same
Seoul National University R&DB Foundation
0 cites - 0 cites
- US118216952023Laminate for Radiational Cooling and Material for Radiational Cooling Containing the Same
KIA CORPORATION
0 cites - 0 cites
- US117423002023Semiconductor Devices and Methods of Manufacturing Semiconductor Devices
Amkor Technology Singapore Holding Pte. Ltd.
0 cites - 0 cites
- US116239712023Freestanding Ion Gel and Method for Preparing the Same
Kunsan National University Industry-university Cooperation Foundation
0 cites - US115695232023Polymer Electrolyte Membrane for Medium and High Temperature, Preparation Method Thereof and High Temperature Polymer Electrolyte Membrane Fuel Cell Comprising the Same
Korea Institute Of Science And Technology
0 cites