Min Hyung Lee

4 Patents

• US121688372024

  Tin-silver Plating Solution and Method for Forming Tin-silver Solder Bump by Using Same

  Dongwoo Fine-chem Co., Ltd.

  0 cites
• US120181262024

  Polyimide Copolymer, Method for Preparing the Polyimide Copolymer, Photosensitive Resin Composition, Photosensitive Resin Film, and Optical Device Using the Polyimide Copolymer

  LG CHEM, Ltd.

  0 cites
• US116401112023

  Photosensitive Resin Composition and Cured Film Comprising the Same

  LG CHEM, Ltd.

  0 cites
• US116249822023

  Photosensitive Resin Composition and Cured Film

  LG CHEM, Ltd.

  0 cites