33 Patents
- US125989852026Semiconductor Structure and Forming Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US124905382025Stacked Structure for CMOS Image Sensors
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123226942025Metal-insulator-metal Device with Improved Performance
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123158432025Hybrid Bonding Technology for Stacking Integrated Circuits
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123006692025Backside Contact for Thermal Displacement in a Multi-wafer Stacked Integrated Circuit
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122835642025Semiconductor Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122782502025Semiconductor Device Including Image Sensor and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122305542025Shield Structure for Backside Through Substrate Vias (tsvs)
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122181062025Backside Contact to Improve Thermal Dissipation Away from Semiconductor Devices
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122181652025Semiconductor Image Sensor and Method of Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US122181662025CSI with Controllable Isolation Structure and Methods of Manufacturing and Using the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122058682025Oversized via as Through-substrate-via (TSV) Stop Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121837612024Semiconductor Structure, Back-side Illuminated Image Sensor and Method for Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US121763702024Stacked Structure for CMOS Image Sensors Including Through-substrate-via Contacting Negative Bias Circuit
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US121425692024Integrated Chip for Standard Logic Performance Improvement Having a Back-side Through-substrate-via and Method for Forming the Integrated Chip
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- 0 cites
- US120339192024Backside or Frontside Through Substrate via (TSV) Landing on Metal
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US120092142024Gate Electrodes with Notches and Methods for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119554282024Semiconductor Structure and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US119423682024Through Silicon Vias and Methods of Fabricating Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119088782024Image Sensor and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US118549592023Metal-insulator-metal Device with Improved Performance
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US117641292023Method of Forming Shield Structure for Backside Through Substrate Vias (TSVS)
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117568622023Oversized via as Through-substrate-via (TSV) Stop Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117569202023Semiconductor Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117569362023Backside Contact to Improve Thermal Dissipation Away from Semiconductor Devices
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117356172023Semiconductor Structure, Back-side Illuminated Image Sensor and Method for Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US116949972023Backside Contact for Thermal Displacement in a Multi-wafer Stacked Integrated Circuit
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites