Min-chien Hsiao

5 Patents

• US125576612026

  Package Structure with Antenna Element

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US123550082025

  Methods of Fabricating Package Structure

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US121193282024

  Methods of Fabricating the Same Die Stack Structure and Semiconductor Structure

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US120150132024

  Die Stack Structure, Semiconductor Structure and Method of Fabricating the Same

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US117054112023

  Chip Package with Antenna Element

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites