Patents/Inventors

Milind Shah

San Diego, CAUS9 patents

10 Patents

US123006552025
Integrated Circuit Assembly with Hybrid Bonding
QUALCOMM INCORPORATED
0 cites
US122718592025
System and Method for Processing Using Weight Data
Doordash, Inc.
0 cites
US120465452024
Hybrid Reconstituted Substrate for Electronic Packaging
QUALCOMM INCORPORATED
0 cites
US118943662024
Trench Capacitor Assembly for High Capacitance Density
QUALCOMM Incorporated
0 cites
US118173792023
Substrate Comprising an Inductor and a Capacitor Located in an Encapsulation Layer
QUALCOMM INCORPORATED
0 cites
US117768882023
Package with a Substrate Comprising Protruding Pad Interconnects
QUALCOMM INCORPORATED
0 cites
US117644892023
Sub-module L-shaped Millimeter Wave Antenna-in-package
QUALCOMM INCORPORATED
0 cites
US116891812023
Package Comprising Stacked Filters with a Shared Substrate Cap
QUALCOMM INCORPORATED
0 cites
US116706142023
Integrated Circuit Assembly with Hybrid Bonding
QUALCOMM INCORPORATED
0 cites
US116521012023
Trench Capacitor Assembly for High Capacitance Density
QUALCOMM Incorporated
0 cites