Patents/Inventors

Milind S. Bhagavat

Wayne, PAUS16 patents

16 Patents

US125724762026
GPU Chiplets Using High Bandwidth Crosslinks
Onesta IP, LLC
0 cites
US123946832025
Molded Semiconductor Chip Package with Stair-step Molding Layer
ADVANCED MICRO DEVICES, Inc.
0 cites
US122665852025
Arrangement and Thermal Management of 3D Stacked Dies
ADVANCED MICRO DEVICES, Inc.
0 cites
US122495192025
Molded Chip Package with Anchor Structures
ADVANCED MICRO DEVICES, Inc.
0 cites
US121836752024
Fan-out Packages with Warpage Resistance
ADVANCED MICRO DEVICES, Inc.
0 cites
US121702632024
Fabricating Active-bridge-coupled GPU Chiplets
Advanced Micro Devices, Inc.
0 cites
US118550612023
Offset-aligned Three-dimensional Integrated Circuit
Advanced Micro Devices, Inc.
0 cites
US118418032023
GPU Chiplets Using High Bandwidth Crosslinks
Advanced Micro Devices, Inc.
0 cites
US118375882023
Circuit Board with Compact Passive Component Arrangement
ADVANCED MICRO DEVICES, Inc.
0 cites
US118108912023
Bond Pads for Low Temperature Hybrid Bonding
ADVANCED MICRO DEVICES, Inc.
0 cites
US118044792023
Scheme for Enabling Die Reuse in 3D Stacked Products
Advanced Micro Devices, Inc.
0 cites
US117423012023
Fan-out Package with Reinforcing Rivets
ADVANCED MICRO DEVICES, Inc.
0 cites
US117156912023
Integrated Circuit Package with Integrated Voltage Regulator
ADVANCED MICRO DEVICES, Inc.
0 cites
US116769242023
Semiconductor Chip with Reduced Pitch Conductive Pillars
ADVANCED MICRO DEVICES, Inc.
0 cites
US116706242023
Integrated Circuit Module with Integrated Discrete Devices
Advanced Micro Devices, Inc.
0 cites
US116581232023
Hybrid Bridged Fanout Chiplet Connectivity
ADVANCED MICRO DEVICES, Inc.
0 cites