15 Patents
- US125815932026Prepreg, and Metal-clad Laminated Board and Wiring Substrate Obtained Using Same
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.
0 cites - 0 cites
- US122336212025Copper-clad Laminated Plate, Resin-clad Copper Foil, and Circuit Substrate Using Said Plate and Foil
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.
0 cites - 0 cites
- US120245902024Resin Composition, Prepreg, Film with Resin, Metal Foil with Resin, Metal-clad Laminate, and Wiring Board
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.
0 cites - US120226112024Prepreg, Metal-clad Laminate, and Wiring Board
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.
0 cites - 0 cites
- US119016552024Pin Terminal, Connector, Wiring Harness with Connector and Control Unit
SUMITOMO ELECTRIC INDUSTRIES, Ltd.
0 cites - 0 cites
- US118665362024Copper-clad Laminate Plate, Resin-attached Copper Foil, and Circuit Board Using Same
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.
0 cites - US118201052023Prepreg, Metal-clad Laminate, and Wiring Board
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.
0 cites - 0 cites
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- US117053102023Plasma Probe Device, Plasma Processing Apparatus, and Control Method
TOKYO ELECTRON LIMITED
0 cites - 0 cites