Patents/Inventors

Miki Okumura

OsakaJP2 patents

3 Patents

US121043742024
Sound Insulation Structure of Partition Wall and Method for Constructing Partition Wall
SEKISUI HOUSE, Ltd.
0 cites
US119330412024
Sound-insulating Structure for Building
SEKISUI HOUSE, Ltd.
0 cites
US118669302024
Partition Wall Sound-insulation Structure and Sound-insulation Member for Partition Wall
SEKISUI HOUSE, Ltd.
0 cites