12 Patents
- US121273382024Semi-flex Component Carrier with Dielectric Material Surrounding an Embedded Component and Having Locally Reduced Young Modulus
At&s(china) Co. Ltd.
0 cites - US120588102024Semi-flex Component Carrier with Dielectric Material Having High Elongation and Low Young Modulus
At&saustria Technologie &Systemtechnik AG
0 cites - US120481012024Component Carrier with Well-defined Outline Sidewall Cut by Short Laser Pulse And/or Green Laser
At&s(china) Co. Ltd.
0 cites - US120417302024Component Carrier with Low-solvent Fiber-free Dielectric Layer
At&saustria Technologie & Systemtechnik AG
0 cites - US119633102024Component Carrier Having Component Covered with Ultra-thin Transition Layer
At&s(china) Co. Ltd.
0 cites - US117006902023Component Carrier with Blind Hole Filled with an Electrically Conductive Medium and Fulfilling a Minimum Thickness Design Rule
AT&S (China) Co. Ltd.
0 cites - 0 cites
- US116706132023Arrangement with Central Carrier and Two Opposing Layer Stacks, Component Carrier and Manufacturing Method
AT&S (China) Co. Ltd.
0 cites - 0 cites
- US116172592023Component Carrier with Embedded Component Exposed by Blind Hole
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
0 cites - US116055692023Packaged Integrated Circuit with Interposing Functionality and Method for Manufacturing Such a Packaged Integrated Circuit
At&saustria Technologie & Systemtechnik AG
0 cites - US115469902023Component Carrier with Bridge Structure in Through Hole Fulfilling Minimum Distance Design Rule
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
0 cites