Patents/Inventors

Mihir Roy

Sachse, TXUS3 patents

4 Patents

US123344132025
System in Package with Flip Chip Die Over Multi-layer Heatsink Stanchion
Qorvo US, Inc.
0 cites
US120876562024
Package Architecture Utilizing Wafer to Wafer Bonding
Qorvo US, Inc.
0 cites
US119423912024
System in Package with Flip Chip Die Over Multi-layer Heatsink Stanchion
Qorvo US, Inc.
0 cites
US116370502023
Package Architecture Utilizing Wafer to Wafer Bonding
Qorvo US, Inc.
0 cites