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Mihir K. Roy
Chandler, AZ
US
3 patents
4 Patents
US12094831
2024
High Density Interconnect Device and Method
Tahoe Research, Ltd.
0 cites
US12002762
2024
High Density Organic Bridge Device and Method
Intel Corporation
0 cites
US11664320
2023
High Density Interconnect Device and Method
Tahoe Research, Ltd.
0 cites
US11608564
2023
Helical Plated Through-hole Package Inductor
Intel Corporation
0 cites