Michiko Natori

4 Patents

• US125648792026

  Copper Paste for Joining, Method for Manufacturing Joined Body, and Joined Body

  RESONAC CORPORATION

  0 cites
• US125448322026

  Copper Paste, Wick Formation Method, and Heat Pipe

  Resonac Corporation

  0 cites
• US123549142025

  Method for Producing Substrate Having Through-silicon Vias, Substrate Having Through-silicon Vias, and Copper Paste for Through-silicon via Formation

  Resonac Corporation

  0 cites
• US122334602025

  Copper Paste, Wick Formation Method, and Heat Pipe

  Resonac Corporation

  0 cites