Michelle Yejin Kim

6 Patents

• US125819662026

  Electronic Component Placed on Core of Substrate

  QUALCOMM INCORPORATED

  0 cites
• US125001462025

  Substrate(s) for an Integrated Circuit (IC) Package Employing a Metal Core for Improved Electrical Shielding and Structural Strength, and Related IC Packages and Fabrication Methods

  QUALCOMM INCORPORATED

  0 cites
• US124245592025

  Package with a Substrate Comprising Embedded Escape Interconnects and Surface Escape Interconnects

  QUALCOMM INCORPORATED

  0 cites
• US123622692025

  Integrated Circuit (IC) Packages Employing Supplemental Metal Layer Coupled to Embedded Metal Traces in a Die-side Embedded Trace Substrate (ETS) Layer, and Related Fabrication Methods

  QUALCOMM INCORPORATED

  0 cites
• US117913202023

  Integrated Circuit (IC) Packages Employing a Package Substrate with a Double Side Embedded Trace Substrate (ETS), and Related Fabrication Methods

  QUALCOMM INCORPORATED

  0 cites
• US116769052023

  Integrated Circuit (IC) Package with Stacked Die Wire Bond Connections, and Related Methods

  QUALCOMM INCORPORATED

  0 cites