46 Patents
- US124036892025Print Component with Memory Array Using Intermittent Clock Signal
Hewlett-packard Development Company, L.P.
0 cites - US123910442025Fluid Ejection Device with Break(s) in Cover Layer
Hewlett-packard Development Company, L.P.
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- US123437562025Fluid Dispensing Devices with Enhanced Heating Elements for Non-aqueous Fluids
Hewlett-packard Development Company, L.P.
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- US122402312025Integrated Circuit with Address Drivers for Fluidic Die
Hewlett-packard Development Company, L.P.
0 cites - US122335982025Processes for Formation of Molded Panels by Bringing Release Liner of Mold Chase in Direct Contact with Protective Layer
Hewlett-packard Development Company, L.P.
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- US120976952024Accessing Registers of Fluid Ejection Devices
Hewlett-packard Development Company, L.P.
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- US119043122024Microfluidic Devices with Lid for Loading Fluid
Hewlett-packard Development Company, L.P.
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- US117600852023Accessing Registers of Fluid Ejection Devices
Hewlett-packard Development Company, L.P.
0 cites - US117455072023Fluid Ejection Device with Break(s) in Cover Layer
Hewlett-packard Development Company, L.P.
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- US117314192023Integrated Circuits Including Customization Bits
Hewlett-packard Development Company, L.P.
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- US116546802023Fluidic Ejection Dies with Enclosed Cross-channels
Hewlett-packard Development Company, L.P.
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- US116428852023Fluid Ejection Device Including Fluid Output Channel
Hewlett-packard Development Company, L.P.
0 cites - US116390552023Fluid Ejection Devices Including Contact Pads
Hewlett-packard Development Company, L.P.
0 cites - 0 cites
- US115972042023Fluid Ejection Polymeric Recirculation Channel
Hewlett-packard Development Company, L.P.
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- US115599852023Integrated Circuit with Address Drivers for Fluidic Die
Hewlett-packard Development Company, L.P.
0 cites - US115482872023Fluidic Die Assemblies with Rigid Bent Substrates
Hewlett-packard Development Company, L.P.
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