Patents/Inventors

Michael J. Seddon

Gilbert, AZUS49 patents

53 Patents

US126223122026
Multichip Module Supports and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US124761322025
Curved Semiconductor Die Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US124697092025
Semiconductor Package Electrical Contact Structures and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US124446092025
Silicon-on-insulator Die Support Structures and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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US124313592025
Semiconductor Package Electrical Contacts and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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US123745552025
Die Sidewall Coatings and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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US123763332025
Configurable Low Ohmic Power Circuits
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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US123745542025
Semiconductor Packages with Die Including Cavities and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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US123549172025
Singulation Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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US123410692025
Backside Metal Patterning Die Singulation System and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US123226322025
Substrate Alignment Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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US123157652025
Backside Metal Patterning Die Singulation Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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US122725722025
Non-planar Semiconductor Packaging Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122665902025
Dual Side Direct Cooling Semiconductor Package
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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US122551672025
Semiconductor Packages with an Intermetallic Layer
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122305432025
Die Cleaning Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122305512025
Immersion Direct Cooling Modules
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122305592025
Semiconductor Device and Method of Forming Micro Interconnect Structures
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122305022025
Semiconductor Package Stress Balance Structures and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122117842025
SOI Substrate and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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US121548772024
Semiconductor Wafer and Method of Ball Drop on Thin Wafer with Edge Support Ring
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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US121547832024
Semiconductor Wafer and Method of Wafer Thinning
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US121486652024
Jet Ablation Die Singulation Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US121320052024
Supports for Thinned Semiconductor Substrates and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US121320082024
Multidie Supports and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US121192942024
Through-substrate via Structure and Method of Manufacture
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US120947502024
Tape Heating Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US120401922024
Die Sidewall Coatings and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US120402952024
Semiconductor Device with Backmetal and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US120209722024
Curved Semiconductor Die Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119878742024
Backside Metal Formation Methods and Systems
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119729802024
Singulation Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119488802024
SOI Substrate and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119423662024
Backside Metal Patterning Die Singulation Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119292852024
Backside Metal Patterning Die Singulation System and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119086992024
Semiconductor Packages with Die Including Cavities
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119011842024
Backmetal Removal Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US118942452024
Non-planar Semiconductor Packaging Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US118549952023
Supports for Thinned Semiconductor Substrates and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US118548892023
Die Cleaning Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US118307712023
Semiconductor Substrate Production Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US118307562023
Temporary Die Support Structures and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US118239652023
Substrate Processing Carrier
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US118239532023
Semiconductor Substrate Processing Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US117568302023
Jet Ablation Die Singulation Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US117106912023
Semiconductor Device and Method of Forming Micro Interconnect Structures
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US116949372023
Semiconductor Wafer and Method of Probe Testing
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US116768632023
Structures for Aligning a Semiconductor Wafer for Singulation
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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US116519982023
Plasma Die Singulation Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US116520102023
Semiconductor Substrate Crack Mitigation Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US116160082023
Through-substrate via Structure and Method of Manufacture
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US116055612023
Backside Metal Removal Die Singulation Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US115812232023
Backside Metal Patterning Die Singulation System and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites