Michael Eritt

2 Patents

• US124397662025

  Encapsulation System for an Optoelectronic Component Comprising at Least a First Encapsulation and a Second Encapsulation, and Optoelectronic Component Comprising an Encapsulation System of This Kind

  HELIATEK GmbH

  0 cites
• US122074822025

  Method for Electrically Conductively Contacting an Optoelectronic Component Having at Least One Protective Layer and Optoelectronic Component Having a Contacting of This Type

  HELIATEK GmbH

  0 cites