Mi Sun Hwang

6 Patents

• US123895462025

  Printed Circuit Board, Electronic Component-embedded Substrate, and Manufacturing Method Thereof

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US119105272024

  Substrate with Electronic Component Embedded Therein

  Samsung Electro-mechanics Co., Ltd.

  0 cites
• US117639822023

  Inductor and Manufacturing Method Thereof

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US117440122023

  Printed Circuit Board and Substrate Including Electronic Component Embedded Therein

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US116409522023

  Electronic Component Embedded Substrate

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US116316432023

  Substrate Embedded Electronic Component Package

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites