8 Patents
- US121729322024Preparation Method for Microwave Dielectric Resonator with Laminated Structure
Huzhou Ceramic-chip Electronic Technology Co., Ltd.
0 cites - US119875322024Ion-modified Microwave Dielectric Ceramic and Preparation Method Thereof, and Microwave Component
Huzhou Ceramic-chip Electronic Technology Co., Ltd.
0 cites - US118978152024Mg—ta Based Dielectric Ceramic for Multi-layer Ceramic Capacitor and Low-temperature Preparation Method Thereof
Yangtze Delta Region Institute (Huzhou), University Of Electronic Science And Technology Of China
0 cites - US118732482024Modified Nio-ta 2 O 5 -based Microwave Dielectric Ceramic Material Sintered at Low Temperature and Its Preparation Method
Yangtze Delta Region Institute Of University Of Electronic Science And Technology Of China, Huzhou
0 cites - US118588552024Low-temperature Sintered Microwave Dielectric Ceramic Material and Preparation Method Thereof
Yangtze Delta Region Institute (Huzhou), University Of Electronic Science And Technology Of China
0 cites - US118547452023Modified Ni—ti—ta Dielectric Material for Multi-layer Ceramic Capacitor and Low-temperature Preparation Method Thereof
Yangtze Delta Region Institute (Huzhou), University Of Electronic Science And Technology Of China
0 cites - US117460562023Modified Nita 2 O 6 -based Microwave Dielectric Ceramic Material Co- Sintered at Low Temperature and Its Preparation Method
Yangtze Delta Region Institute Of University Of Electronic Science And Technology Of China, Huzhou
0 cites - US117249662023Microwave Dielectric Ceramic Material and Preparation Method Thereof
UNIVERSITY OF ELECTRONIC SCI. AND TECH. OF CHINA
0 cites