Mengbin Liu

3 Patents

• US119791362024

  Air Gap Type Semiconductor Device Package Structure

  Ningbo Semiconductor International Corporation

  0 cites
• US119179182024

  Fingerprint Identification Module, Method for Forming Fingerprint Identification Module, and Electronic Device

  NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION

  0 cites
• US116953872023

  Air Gap Type Semiconductor Device Package Structure and Fabrication Method Thereof

  NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION (SHANGHAI BRANCH)

  0 cites