Meng-tsung Kuo

2 Patents

• US123746002025

  Dam Structure on Lid to Constrain a Thermal Interface Material in a Semiconductor Device Package Structure and Methods for Forming the Same

  Taiwan Semiconductor Manufacturing Company Limited

  0 cites
• US119787152024

  Structure and Formation Method of Chip Package with Protective Lid

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites