Patents/Inventors

Meng-tsan Lee

HsinchuTW9 patents

9 Patents

US125507372026
Semiconductor Package and Method
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US125507832026
Device and Method for UBM/RDL Routing
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US125060872025
Semiconductor Package with Redistribution Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123947542025
Device and Method for UBM/RDL Routing
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123227272025
Device and Method for UBM/RDL Routing
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122242472025
Fan-out Package Having a Main Die and a Dummy Die
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119675632024
Fan-out Package Having a Main Die and a Dummy Die
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119554392024
Semiconductor Package with Redistribution Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US115812682023
Semiconductor Package with Redistribution Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites