Meng-pei Lu

9 Patents

• US124128372025

  Interconnect Structure Including Topological Material

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US123477762025

  Integrated Chip with Graphene Based Interconnect

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US123005992025

  Method for Forming Semiconductor Structure

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.

  0 cites
• US122180602025

  Integrated Chip with Graphene Based Interconnect

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US120682532024

  Semiconductor Structure with Two-dimensional Conductive Structures

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.

  0 cites
• US120274192024

  Semiconductor Device Including Liner Structure

  Taiwan Semiconductor Manufacturing Company Limited

  0 cites
• US119087942024

  Protection Liner on Interconnect Wire to Enlarge Processing Window for Overlying Interconnect Via

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US116826162023

  Semiconductor Structure and Method for Forming the Same

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.

  0 cites
• US115519672023

  Via Structure and Methods for Forming the Same

  Taiwan Semiconductor Manufacturing Company Limited

  0 cites