Mei-yee Shek

6 Patents

• US125435472026

  Method of Dielectric Material Fill and Treatment

  Applied Materials Inc.

  0 cites
• US120465082024

  Method of Dielectric Material Fill and Treatment

  APPLIED MATERIALS, Inc.

  0 cites
• US118814112024

  High Pressure Annealing Process for Metal Containing Materials

  Applied Materials, Inc.

  0 cites
• US116159842023

  Method of Dielectric Material Fill and Treatment

  APPLIED MATERIALS, Inc.

  0 cites
• US115811832023

  Methods of Forming Amorphous Carbon Hard Mask Layers and Hard Mask Layers Formed Therefrom

  Applied Materials, Inc.

  0 cites
• US115663252023

  Silicon Carbonitride Gapfill with Tunable Carbon Content

  Applied Materials, Inc.

  0 cites