Patents/Inventors

Mei Fen Hiew

MelakaMY6 patents

4 Patents

US125123802025
Semiconductor Packages Including a Package Body with Grooves Formed Therein
Infineon Technologies AG
0 cites
US122058742025
Semiconductor Package with Wire Bond Joints
Infineon Technologies AG
0 cites
US118429532023
Semiconductor Package with Wire Bond Joints and Related Methods of Manufacturing
Infineon Technologies AG
0 cites
US116212042023
Molded Semiconductor Module Having a Mold Step for Increasing Creepage Distance
Infineon Technologies AG
0 cites