11 Patents
- US125640152026Integrated Inspection for Enhanced Hybrid Bonding Yield in Advanced Semiconductor Packaging Manufacturing
Applied Materials Inc.
0 cites - US125470832026Use of Alternating Layer Patterns Approach for Effective Overlay Metrology in Multi-stack Die Applications
Applied Materials, Inc.
0 cites - US124552382025Time Delay Integration Acquisition for Spatial Genomics Imaging
Applied Materials, Inc.
0 cites - US123946552025Subsurface Alignment Metrology System for Packaging Applications
APPLIED MATERIALS, Inc.
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- US122764902025System and Method to Map Thickness Variations of Substrates in Manufacturing Systems
Applied Materials, Inc.
0 cites - 0 cites
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- US120026652024Real-time Detection of Particulate Matter During Deposition Chamber Manufacturing
Applied Materials, Inc.
0 cites - 0 cites