7 Patents
- US125754682026Roughened Surface of a Conductive Wedge Bonded Ribbon Encapsulated in a Sermiconductor Package
Stmicroelectronics S.r.l.
0 cites - US125576692026Method of Manufacturing Semiconductor Devices, Corresponding Substrate and Semiconductor Device
Stmicroelectronics S.r.l.
0 cites - US125388092026Method of Manufacturing Semiconductor Devices and Corresponding Semiconductor Device
Stmicroelectronics S.r.l
0 cites - US124631702025Semiconductor Device and Assortment of Semiconductor Devices with Electrically Conductive Ribbon Configurations
Stmicroelectronics S.r.l.
0 cites - US124566292025Method of Producing Substrates for Semiconductor Device Packages Comprising Anchoring Encapsulation to Die Pad
Stmicroelectronics S.r.l.
0 cites - US119675442024Method of Manufacturing Semiconductor Products, Corresponding Substrate, Semiconductor Product and Tool
Stmicroelectronics S.r.l.
0 cites - US115575472023Leadframe for Semiconductor Devices, Corresponding Semiconductor Product and Method
Stmicroelectronics S.r.l.
0 cites