29 Patents
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- US125987772026Low Temperature, High Germanium, High Boron Sige:b Pepi with Titanium Silicide Contacts for Ultra-low PMOS Contact Resistivity and Thermal Stability
Intel Corporation
0 cites - US125751702026Low Temperature, High Germanium, High Boron Sige:b Pepi with a Silicon Rich Capping Layer for Ultra-low PMOS Contact Resistivity and Thermal Stability
Intel Corporation
0 cites - US125325382026Integrated Circuit Structures Having Conductive Structures in Fin Isolation Regions
Intel Corporation
0 cites - US125016842025Integrated Circuit Structures with Backside Self-aligned Penetrating Conductive Source or Drain Contact
Intel Corporation
0 cites - US124842472025Gate-all-around Integrated Circuit Structures Having Backside Contact with Enhanced Area Relative to Epitaxial Source
Intel Corporation
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- US122307172025Integrated Circuit Structures Having Partitioned Source or Drain Contact Structures
Intel Corporation
0 cites - US122307212025Gate-all-around Integrated Circuit Structures Having Asymmetric Source and Drain Contact Structures
Intel Corporation
0 cites - US121702732024Integrated Circuit Assemblies with Direct Chip Attach to Circuit Boards
Intel Corporation
0 cites - US121470832024Hybrid Manufacturing for Integrating Photonic and Electronic Components
Intel Corporation
0 cites - US121487512024Use of a Placeholder for Backside Contact Formation for Transistor Arrangements
Intel Corporation
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- US119013472024Microelectronic Package with Three-dimensional (3D) Monolithic Memory Die
Intel Corporation
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- US117990372023Gate-all-around Integrated Circuit Structures Having Asymmetric Source and Drain Contact Structures
Intel Corporation
0 cites - US117568862023Hybrid Manufacturing of Microeletronic Assemblies with First and Second Integrated Circuit Structures
Intel Corporation
0 cites - US116902112023Thin Film Transistor Based Memory Cells on Both Sides of a Layer of Logic Devices
Intel Corporation
0 cites - US116213542023Integrated Circuit Structures Having Partitioned Source or Drain Contact Structures
Intel Corporation
0 cites - US116160152023Integrated Circuit Device with Back-side Interconnection to Deep Source/drain Semiconductor
Intel Corporation
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