3 Patents
- US118848592024Tungsten Chemical Mechanical Planarization (CMP) with Low Dishing and Low Erosion Topography
Versum Materials US, LLC
0 cites - US116435992023Tungsten Chemical Mechanical Polishing for Reduced Oxide Erosion
VERSUM MATERIALS US, LLC
0 cites - US115921282023Sealing Profile for Embedding Into a Moulding of Curable Material
Daetwyler Sealing Technologies Deutschland GmbH
0 cites