Patents/Inventors

Matthias Fettke

BerlinDE5 patents

6 Patents

US124855002025
Method for Monitoring a Laser Soldering Process, and Laser Soldering System Using a Spectroscope Device
PAC TECH—PACKAGING TECHNOLOGIES GmbH
0 cites
US123580842025
Bonding Head and Bonding Apparatus
Pac Tech—packaging Technologies GmbH
0 cites
US123492872025
Method for Soldering an Electronic Component to a Circuit Board by Jetting Liquefied Solder Into a Through Hole
Pac Tech—packaging Technologies GmbH
0 cites
US121710662024
Method for Removing and Repositioning Electronic Components Connected to a Circuit Board
Pac Tech—packaging Technologies GmbH
0 cites
US120237562024
Method for Removing Electronic Components Connected to a Circuit Board
Pac Tech—packaging Technologies GmbH
0 cites
US120289872024
Method for Soldering an Electronic Component to a Circuit Board by Jetting Liquefied Solder Into a Through Hole
Pac Tech—packaging Technologies GmbH
0 cites